| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a board in which thermal and electric conductivity posts are sealed with very small irregularities in shape and size, to enables wiring of a short distance and to increase the operating frequency. SOLUTION: A method for manufacturing a build-up core board comprises steps of (1) connecting a post forming layer (made of Cu or the like) on one main surface of a barrier layer (made of Ni, Ti, Sn or the like) and a carrier layer (made of Fe-Ni alloy or the like) on another main surface, (2) removing by etching to arrive at the barrier layer, forming a plurality of pattern etched products made to stand at a prescribed pitch of the post (made of Cu or the like), laminating a prepreg, heating and pressing to form a first laminated item, (3) removing the carrier layer from the first laminated item, and (4) obtaining the second laminate by removing the barrier layer, laminating the prepreg, heating and pressing, to manufacture the build-up core board.</p> |
