SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to make a center of a conductive bump entirely flat by coining the conductive bump and forming more unevenness on a surface of the conductive bump and to improve the connection reliability by securing a wide area contacting with a solder paste. CONSTITUTION: A conductive pad(14) is formed on a position matching to the respective I/O pads(8) of a semiconductor chip(6). The respective conductive pads are formed on a substrate(12). The conductive bump(10) such as a gold, a solder or an adhesive tape having an unevenness surface(10a) on a bottom surface is formed on the I/O pad. The solder paste(16) is formed on the conductive pad of the substrate. The solder paste is melted with the conductive bump. Because of the uneven bottom surface of the conductive bump, the contact area between the conductive bump and the solder paste is enlarged.