发明名称 SEMICONDUCTOR DEVICE USING PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a printed-wiring board that easily prevents lift-off from occurring even if lead-free solder is used, has superior productivity, and reduces the costs. SOLUTION: A lead section 5 of an insertion component is inserted into a conductive section 31 of a through hole 3 in a printed-wiring board body 1, and is soldered for mounting. The circumference section of the through hole 3 on the surface at an insertion component-mounting side on the printed-wiring board 1 is covered with solder resist 2, and exposure in a land section 4 is set to 100μm or less.
申请公布号 JP2002190664(A) 申请公布日期 2002.07.05
申请号 JP20000388272 申请日期 2000.12.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 MURAI JUNICHI;IDETA GORO;SAKAGAMI YUKINOBU;MURAKAMI KOHEI
分类号 B23K1/00;B23K101/40;H01L23/12;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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