发明名称 COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling device by which an object to be cooled, such as a liquid reagent or the like, is cooled with a simple constitution without using a drive unit, while cooling the object to be cooled. SOLUTION: The cooling device is provided with a heat-insulating housing body 96, which comprises a heat-insulating space 99 for storing a reagent container 95 having a cooling solution, such as the object to be cooled and which can maintain the space 99 at a prescribed temperature and a cooling mechanism, which cools the side face of the reagent container 95 stored in the housing body 96. The housing body 96 comprises a metal bottom face wall 96c of high thermal conductivity. The cooling mechanism is provided with a cooling unit 97, which supports the wall 96c to be capable of being cooled, a synthetic-resin mounting member 100, on which the reagent container 95 is mounted and whose heat-insulating property is high and a metal inside sidewall 98 which, is bonded to the surface of the wall 96c, which is formed so as to be brought into contact with, or is brought close to the side face of the reagent container 95 mounted on the mounting member 100, and whose thermal conductivity is high.
申请公布号 JP2002189031(A) 申请公布日期 2002.07.05
申请号 JP20000390460 申请日期 2000.12.22
申请人 FURUNO ELECTRIC CO LTD;KAINOSU:KK 发明人 MIKI YASUSHI;TAMURA TORU;UECHI SHIRO
分类号 G01N35/00;(IPC1-7):G01N35/00 主分类号 G01N35/00
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