| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturized pressure sensor module. SOLUTION: This module is equipped with a semiconductor pressure sensor part 1, an IC part 2, a ROM loading part 3, an electrical connection means connected electrically to the semiconductor pressure sensor part 1 and at least either of the IC part 2 and the ROM loading part 3, and a package having a body part 6 and a cover part 7. In the module, the semiconductor pressure sensor part 1 is loaded on the body part 6, and the IC part 2 and the ROM loading part 3 are loaded on the cover part 7, and the cover part 7 is bonded with the body part 6 so that the semiconductor pressure sensor part 1 is faced to the IC part 2 and the ROM loading part 3.
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