发明名称 RADIATION TEMPERATURE MEASURING DEVICE AND RADIATION TEMPERATURE MEASURING METHOD AND SEMICONDUCTOR MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a radiation temperature measuring device and a radiation temperature measuring method capable of realizing highly accurate temperature measurement without depending on the emissivity of a measuring object, and a semiconductor manufacturing device. SOLUTION: This radiation temperature measuring device including a lamp house 1 for heating a wafer 3 by irradiating the wafer 3 with light is characterized by being equipped with a wafer 4 for constituting a closed space by combination with the wafer 3, and reflecting light radiated from the wafer 3 in the closed space, photodetectors 9a, 9b for measuring the intensity of light provided from the wafers 3, 4 in the closed space, and a control part 29 for controlling the lamp house 1 so that the intensities of light measured by the photodetectors 9a, 9b become equal, and measuring the equalized light intensity.
申请公布号 JP2002188963(A) 申请公布日期 2002.07.05
申请号 JP20000386041 申请日期 2000.12.19
申请人 TOKYO ELECTRON LTD 发明人 SUZUKI TOMOHIRO;MATSUDO TATSUO
分类号 G01J5/02;G01J5/00;H01L21/26;H01L21/66;(IPC1-7):G01J5/02 主分类号 G01J5/02
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