HIGH-FREQUENCY INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To manufacture an integrated circuit device wherein the deterioration of the performance of its circuit generated due to dielectrics can be reduced and its reliability relative to physical shocks is also made high. SOLUTION: In the integrated circuit device, a semiconductor chip 103 is subjected to flip-chip mounting on the surface of a wiring board 110, so as to joint it mechanically to the wiring board 110 by using an insulating bonding agent 104. In the wiring board 110, there is formed a cavity region 106, having such a shape/dimension that the insulating bonding agent will not penetrate to reach active circuits 10f7 provided in the semiconductor chip 103.