METHOD OF MANUFACTURING IC MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a non-contact type IC module of low cost by rationalizing a temporary pressure-bonding process of an adhesive film. SOLUTION: In this method of manufacturing the non-contact type IC module, a manufacturing method adopted to attain the purpose in connecting an IC electrode to an antenna pattern on a resin film sheet through the adhesive film, is a method of temporarily pressure-bonding the adhesive film in block to a plurality of antenna patterns arranged in a line and then mounting IC chips and carrying out proper pressure-bonding by heating and pressurizing.