| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of evaluating a heat treating effect by which the heat treating effect which a resist film receives actually through the whole of a baking step can be actualized and can be appropriately evaluated and to provide a method of evaluating a baking apparatus. SOLUTION: On a resist baking temperature-residual film rate curve, a region A in which the relation between the residual film rate and baking temperature of a resist film subjected to excessive film reduction treatment is represented by a steep and linear slope is present, and the dispersion in heat treating effect can be actualized as dispersion in residual film rate by using the region A as a working curve, and the heat treating effect which the resist film receives actually through the whole of a baking step can be appropriately evaluated. |
