| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that maintenance has to be frequently carried out for cleaning the brush since the amount of solder adhering to a conveyer nib is large in the case of high-temperature solder (Pd-free solder) although the solder can be removed by the brush, since the amount of the solder adhering to the conveyer nib is small in the case of Pd-Sn solder in the conventional automatic soldering device for mechanically performing elimination by the brush at a section for removing the solder adhering to the conveyer nib. SOLUTION: In a method for removing the solder adhering to the conveyer nib without any contact, hot air is sprayed to the nib for blowing off the adhering solder, thus eliminating the maintenance conventionally required for cleaning the brush.
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