STRUCTURE FOR CONDUCTIVE BUMP OF SEMICONDUCTOR CHIP AND FORMING METHOD THEREOF

摘要

PURPOSE: A structure for a conductive bump of a semiconductor chip and a forming method thereof are provided to absorb the stress due to a difference of a thermal expansion coefficient by increasing a thickness of the conductive bump formed on a surface of the semiconductor chip. CONSTITUTION: A mask having a plurality of holes and an adhesive tape(6) having an adhesive layer(6a) on one side is prepared. After attaching the mask to the adhesive layer of the adhesive tape, each second conductive ball(4b) is adhered to the adhesive layer by inputting the second conductive ball to each hole of the mask. After removing the mask and pressing the second conductive ball with a plate panel, the second conductive ball is positioned within the adhesive layer. The semiconductor chip(1) having the first conductive ball(4a) is prepared. After fitting the position of the first and the second conductive ball, the first and the second conductive ball are melted and connected with each other by a reflowing process and the adhesive tape is removed.