| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of limit in the increase of density and integration of an electronic circuit of a semiconductor element and of the requirements from an electronic device not being able to be coped with. SOLUTION: There are provided an external terminal 5, a substrate 1, a first semiconductor element 2 on the substrate 1 which comprises a plurality of electrode pads 2a on its upper surface; an electrically insulating substrate 4 on the first semiconductor element 2 which comprises a plurality of connection pads 4a on its surface; a second semiconductor element 3 on the electrically insulating substrate 4 which comprises a plurality of electrode pads 3a on its upper surface; a wire 6 which electrically connects the electrode pads 2a and 3a of the first and second semiconductor elements 2 and 3, the external terminal 5, and the connection pad 4a together; and a resin-coating material 7, which coats the first and second semiconductor elements 2 and 3. |
