| 摘要 |
PROBLEM TO BE SOLVED: To prevent pores from being produced in a coating material covering a recess formed, adjusting the wiring length of a multilayer printed circuit board. SOLUTION: A method for manufacturing a multilayer printed circuit board comprises steps of partially cutting out an electrode 12 formed on a VCO circuit board (multilayer printed circuit board) 10 by a laser, and coating a recess 16 formed at the cut out part, with an ultraviolet curable resin 14 as a coating material. |
