| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation such as cracks in separating the device layer to increase the production yield. SOLUTION: In the production method of thin film magnetic head, the device layer 2 is formed by shaping the metal film in a predetermined shape, laminating the insulating layer and fabricating plurality of head tips, and said device layer 2 is by eliminating the separation layer 4, is separated from substrate 1 to obtain individual head tips, in the domain where the said separation layer 4 remains immediately before the separation layer 4 is eliminated, on the Cr surface 61 which is formed to increase the adhesiveness, the Cu film is formed to prevent the adhesiveness, the adhesiveness of the remaining separation layer 41 to the substrate 1 is made smaller than the adhesiveness of the remaining separation layer 41 to the device layer 2.
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