JIG FOR PREVENTING WARPAGE OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A jig for preventing the warpage of a semiconductor package is provided to restrain the bend of the semiconductor package by pressing the semiconductor package flat with a heavy jig for a time after forming a molding. CONSTITUTION: A subsidence part(8) contacting to the molding of the semiconductor package(3) is formed in a lower jig(7) in order to closely contact a circuit board(4) as well as the molding. A volume of the subsidence part is equal to the volume of the molding protruded from the outside of the circuit board. Thus, the surface of the molding and the circuit board is flattened by closely contacting not only the molding but the surface of the circuit board with a space between the upper jig(6) and the lower jig(7). A number of the lower jigs having the subsidence parts and the semiconductor packages are layered in the up and down direction.