| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for activating impurity elements added to a semiconductor film in the heat treatment of short time, without deforming a board and gettering the semiconductor film, in a manufacturing step of a semiconductor device using the board having a low heat resistance, such as a glass or the like, and to provide an apparatus for heat treating capable of such heat treating. SOLUTION: The method for heat treating is a method of heat treating by irradiating a light emitted from a lamp light source. A light-irradiating time interval per light source is 0.1 to 20 s, and the light from the light source is irradiated a plurality number of times. A light is irradiated from the light source, so that a holding time of the highest temperature of a region to be irradiated is 0.5 to 5 s. Further, accompanying the light source flashings, the supply amount of refrigerant is increased or decreased, so as to enhance heat treatment effects of the film, and to prevent damages to the board due to heat.
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