发明名称 BONDING DATA SETTING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To easily and efficiently set the operation parameter of a bonding tool for turning a wire loop into a desired shape. SOLUTION: When an editing handle 45 is dragged, the loop shape of a loop diagram 70a displayed on a display screen 20 is re-plotted as a loop diagram 70b. The value of the operation parameter, corresponding to the loop shape of the plotted or re-plotted loop diagrams 70a and 70b, is calculated, and the result is displayed in a parameter list 60. The parameter is set easily and efficiently, even by an operator who does not have preliminary knowledge about the correspondence relation of the value of the operating parameters and the shape of a wire loop actually formed.
申请公布号 JP2002190492(A) 申请公布日期 2002.07.05
申请号 JP20000390835 申请日期 2000.12.22
申请人 SHINKAWA LTD 发明人 KIMURA KAZUMASA;WATANABE ICHIJI
分类号 H01L21/60;B23K20/00 主分类号 H01L21/60
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