| 摘要 |
PROBLEM TO BE SOLVED: To provide a hybrid IC, in which the terminal electrodes of electronic components are not short-circuited at solder reflow. SOLUTION: A land electrode 15 for electronic component mounting formed on the main surface of a printed wiring board 11, and the terminal electrodes 121 of the electronic component 12b are connected conductively with conductive resin 18 which will not fuse even when being heated, a resin layer 13 is formed on the main surface of the printed wiring board 11, so as to seal the electronic component 12b and this hybrid IC 10 is constituted. Thus, since the conductive resin 18 will not fuse even if a solder reflow processing is performed at mounting of the hybrid IC 10 onto a master printed wiring board and the electronic component 12b and the printed wiring board 11 are heated, the terminal electrodes 121 are not short-circuited, even if a space (air layer) is formed between the terminal electrodes 121 of the electronic component 12b. |
