ELECTRONIC COMPONENT BONDING METHOD AND DEVICE

摘要

PROBLEM TO BE SOLVED: To simplify device constitution and to improve productivity at bonding of an electronic component to the loading part of a substrate without deviations. SOLUTION: In this electronic component bonding method, the positional deviation from a reference position of the electronic component 2 held by a holding means (holding nozzle 33) is detected, and the position deviation in a rotating direction among the detected positional deviations of the electronic component 2 is corrected by the turning of a turning arm 32.