发明名称 FLEXIBLE WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method for reducing manufacturing costs, and at the same time for manufacturing a flexible wiring board which is easy to handle. SOLUTION: This manufacturing method of a flexible wiring board has process for forming first wiring and guide patterns 2 and 3 or a copper foil 12 and at the outer-periphery section of the first wiring pattern 2, respectively, and a process for forming an insulating film 14 on the first wiring and guide patterns 2 and 3.
申请公布号 JP2002190657(A) 申请公布日期 2002.07.05
申请号 JP20000388499 申请日期 2000.12.21
申请人 SONY CHEM CORP 发明人 KANEDA YUTAKA
分类号 H05K1/11;H01L21/60;H05K1/00;H05K1/02;H05K1/03;H05K1/14;H05K3/06;H05K3/20;H05K3/28;(IPC1-7):H05K3/06 主分类号 H05K1/11
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