发明名称 CONDUCTIVE BOND
摘要 PROBLEM TO BE SOLVED: To retrain an exfoliation due to mismatch of thermal expansion, to strengthen the bonding force and to reduce the cost. SOLUTION: A conductive bond 24 used for bonding an air electrode of a solid electrolyte fuel cell or a steam electrolysis cell and an inter connector where a praseodymium-manganese oxide is utilized.
申请公布号 JP2002190213(A) 申请公布日期 2002.07.05
申请号 JP20010307630 申请日期 2001.10.03
申请人 MITSUBISHI HEAVY IND LTD 发明人 MORI KAZUTAKA;MIYAMOTO HITOSHI;MATSUDAIRA TSUNEAKI;TAKENOBU KOICHI
分类号 C25B13/04;C25B9/00;H01B1/20;H01M8/02 主分类号 C25B13/04
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