| 摘要 |
PROBLEM TO BE SOLVED: To accurately bring a measurement probe into contact with the electrode terminal of a corresponding semiconductor device, when the measurement probe is brought into contact with the electrode terminal exposed on the mounting face of the semiconductor device to measure the characteristics of the semiconductor device. SOLUTION: The mounting face of the semiconductor device A is imaged by a recognition device 7, to detect displacement amount from the reference position of the electrode terminal from the image, and the position of the measuring probe 9 is corrected by the drive mechanism 10 of a probe device 8, on the basis of the displacement amount detected by the recognition device 7, to eliminate position displacement with the electrode terminal of the corresponding semiconductor device A.
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