| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component module which can be mounted on, even a compact portable terminal or the like by reducing the height dimensions of the overall components, including shield cases. SOLUTION: Electronic components 2 and 3 are mounted on the both faces of a substrate 1, and shield cases 4 and 8 are mounted so that the electronic components 2 and 3 can be covered. Also, component-projecting holes 5 and 9 are formed in the shield cases 4 and 8, and bodies 2A1, 2G1, and 3E1 of electronic components 2A, 2G, and 3E, whose height dimensions are higher than those of the other components, are projected from the component projecting holes 5 and 9. Thus, the height dimensions of the shield cases 4 and 8 can be made smaller than those of the electronic components 2A, 2G, and 3E.
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