发明名称 MATERIAL FOR FORMING PROTECTIVE FILM
摘要 PROBLEM TO BE SOLVED: To provide a material for forming a protective film in which no void is formed, even if the aspect ratio of a hole is increased and moreover no difference in the film thickness is produced between a Dense part and an Iso part, when the material for forming a protective film is provided thereon. SOLUTION: In a composition comprising a solid content containing a resin component and a crosslinking agent at a mass ratio of 2:8 to 4:6 and an organic solvent, mass average molecular weight of the solid component is adjusted to be in a range of 1,300-4,500.
申请公布号 JP2002190519(A) 申请公布日期 2002.07.05
申请号 JP20000387638 申请日期 2000.12.20
申请人 TOKYO OHKA KOGYO CO LTD 发明人 IGUCHI ETSUKO;KOSHIYAMA ATSUSHI;WAKIYA KAZUMASA
分类号 H01L23/522;C08L81/06;H01L21/312;H01L21/768;(IPC1-7):H01L21/768 主分类号 H01L23/522
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