| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for inexpensively forming a circuit on a printed- wiring board by reducing defect in a circuit pattern due to dirt, and by shortening processes in circuit formation and exposure time. SOLUTION: A resin layer 13A is provided on the copper surface of a copper- clad, a portion other than the circuit pattern of the resin layer is eliminated with a laser beam 14, copper at the portion other than the circuit pattern is exposed, a circuit pattern 13A' of the resin layer is formed, the circuit pattern of the resin layer is used as a etching resist, the copper at the portion other than the exposed circuit pattern is dissolved and removed by etching, and the circuit pattern on the resin layer is eliminated, thus forming the circuit on the copper-clad.
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