| 摘要 |
The invention concerns a method of performing physical vapor deposition in a reactor chamber on a workpiece positioned on a workpiece support facing the metal sputter target. The method includes sputtering atoms from the metal sputter target by applying a low level of target bias power to the metal sputter target to produce a correspondingly low metal deposition rate on the workpiece. The method further includes ionizing the atoms sputtered from the metal sputter target to an ionization fraction in excess of about 50% by applying a high level of VHF source power to the metal sputter target through a solid large diameter RF feed rod that engages the metal sputter target. The low level of target bias power can be as low as about 500 Watts although it may range up to about 2500 Watts. Preferably, the target bias power is D.C. power. The RF feed rod may be threadably engaged into a receptacle in the center of a top surface of the metal sputter target. Preferably, the method further includes electrostatically clamping the workpiece to the workpiece support.
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