PACKAGING ATMOSPHERE AND METHOD OF PACKAGING A MEMS DEVICE

摘要

The power handling capabilities and operational lifetime of a MEMS device, e.g., a MEMS mirror, operating in a high intensity optical beam environment are enhanced by packaging the device in an packaging atmosphere having a suitably high thermal conductivity, preferably exceeding that of air. The packaging atmosphere can be selected to provide a desired level of heat loss from the MEMS device.