发明名称 Polishing of semiconductor substrates
摘要 An aqueous polishing composition having abrasive particles of a metal oxide has a pH that undergoes pH drift, because ions are provided by dissolution of the metal oxide, and the pH drift is minimized by providing the aqueous polishing composition with an equilibrium concentration of the ions at said pH.
申请公布号 US2002083650(A1) 申请公布日期 2002.07.04
申请号 US20020068213 申请日期 2002.02.06
申请人 THOMAS TERENCE M.;LACK CRAIG D.;GOEHRINGER STEVEN P. 发明人 THOMAS TERENCE M.;LACK CRAIG D.;GOEHRINGER STEVEN P.
分类号 B24B57/02;B24B37/00;C09C1/68;C09G1/02;C09K3/14;C23F1/14;H01L21/304;H01L21/321;(IPC1-7):C09C1/68 主分类号 B24B57/02
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