| 摘要 |
The method uses one photomask and one-exposure steps wherein said photomask comprising two major portions that are formed by mirror image with each other, the wides of openings formed in said photomask being increased from a central portion to an edge portion, the spaces between two adjacent said openings being decreased from said central portion to said edge. Then, shift said substrate with a distance to a direction perpendicular to a surface of said photomask. Next, expose said photosensitive material layer by using said photomask; and developing the photosensitive material to form said bump structure
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