| 摘要 |
PURPOSE: Materials for semiconductor package and manufacturing method of circuit pattern on the same are provided to prevent a parting phenomenon by forming line patterns on the materials. CONSTITUTION: A semiconductor chip(20) including a multitude of input and output pad(21) is adhered on a center of an upper face of a heat-sink(10) by an adhesive(80). An insulating layer(31) is formed on an upper face of the heat-sink(10). A multitude of line pattern(32) including a ball land(32c) and a bond finger(32d) is formed on an upper face of the insulating layer(31). The line patterns(32) are formed by Au or aluminium or copper. A solder mask(33) is coated on the line patterns(32) except for the ball land(32c) and the bond finger(32d) and the upper face of the heat-sink(10). A pattern layer(30) is defined by the insulating layer(31), the line patterns(32), and the solder mask(33). A subsidiary material is formed with the heat-sink(10) and the pattern layer(30). An input and output pads(21) of the semiconductor chip(20) is connected with the bond finger(32d) of the line patterns(32) by a conductive wire(40). A sealing portion(50) is formed by sealing the semiconductor chip(20), the conductive wire(40), and the bond finger(32d). |
