发明名称 |
Cooling device for electronic controllers has cooling plate deformation filling bearer opening in force-locking manner to form fixed mechanical connection between cooling plate and bearer |
摘要 |
The device has at least a first deformation. The bearer has openings and the cooling device mounted on the bearer forms at least one fixed mechanical connection between the cooling device and bearer. The cooling device is a thin movable cooling plate. At least a second deformation of the cooling plate fills the bearer opening in force-locking manner to form a fixed mechanical connection between the cooling plate and bearer. Independent claims are also included for the following: a cooling panel, a method of mechanically joining a cooling panel to as bearer, a method of thermally joining a cooling panel to a bearer and a method of electrically joining a cooling panel to a bearer.
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申请公布号 |
DE10062699(A1) |
申请公布日期 |
2002.07.04 |
申请号 |
DE20001062699 |
申请日期 |
2000.12.15 |
申请人 |
CONTI TEMIC MICROELECTRONIC GMBH |
发明人 |
HOFFMANN, RICHARD;SCHLENKER, ROBERTO |
分类号 |
H05K1/02;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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