| 摘要 |
PURPOSE: A lead frame of semiconductor packages is provided to restrain an external void of a molding part by keeping a constant flowing speed of a molding agent when molding the lead frame. CONSTITUTION: A lead frame(100) of semiconductor package additionally comprises bending parts(3a) alternately formed on defined regions of a number of inner leads(3), and a clamp(6) for supporting the inner leads(3). At this point, the bending parts(3a) are formed on the outer portions of the clamping region and the bending parts respectively have a triangular shape, so that a molding agent is able to easily flow to cavities through the spaces between the bending parts(3a), thereby preventing external voids of a molding part. |
