| 摘要 |
PURPOSE: A mold frame for manufacturing semiconductor packages is provided to improve a manufacturing efficiency by preventing a warpage phenomenon of a PCB(Printed Circuit Board) using spring pins. CONSTITUTION: A mold frame additionally includes a number of spring parts installed on a clamping surface of an upper clamp(1), and pins(7) having the same number of the spring parts formed to be protruded to external direction and supported by the spring parts with an elasticity. At this point, the pins(7) are formed on symmetrical portions of the upper clamp(1), so that bent portions of a PCB(Printed Circuit Board) are spreaded by the pins(7) when performing a clamping process. After completely clamping, the spring parts are shrank, thereby entering the pins(7) into the upper clamp(1).
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