发明名称 |
THERMALLY ENHANCED MICROCIRCUIT PACKAGE AND METHOD OF FORMING SAME |
摘要 |
A thermally enhanced microcircuit package includes a microcircuit having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. |
申请公布号 |
WO02052644(A2) |
申请公布日期 |
2002.07.04 |
申请号 |
WO2001US45063 |
申请日期 |
2001.11.28 |
申请人 |
HARRIS CORPORATION |
发明人 |
NEWTON, CHARLES;RUMPF, RAYMOND;GAMLEN, CAROL |
分类号 |
B81B1/00;B81C1/00;F28D15/04;H01L23/427 |
主分类号 |
B81B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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