BALL LAND STRUCTURE OF SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A ball land structure of semiconductor packages is provided to improve an attaching reliability by increase an attaching surface between solder balls and ball lands. CONSTITUTION: A ball land(1) structure of semiconductor packages comprises a solder ball(7) mounted on the ball land(1), and a solder mask(2) connected with both sidewalls of the ball land(1). The ball land(1) further includes a first surface(1a) formed on the rear surface of the ball land(1), a second surface(1b) formed on the front surface of the ball land(1) having a dented rounding shaped, a third surface(1c) formed both sides of the ball land(1), and spaces(3) for increasing a contact surface between the solder ball(7) and the edge portions of the second surface(1b), thereby strongly attaching the solder ball(7) with the second surface(1b) of the ball land(1).