UNIVERSAL SOCKET FOR TESTING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A universal socket for testing a semiconductor package is provided to test various kinds of semiconductor packages regardlessly of a size of a body and the number of ball. CONSTITUTION: A multitude of contact pad(2) is formed on an upper face of an insulating plate(1) of a rectangular shape. The contact pad(2) has a constant pitch and a multitude of row and column. A multitude of ball(61) of a semiconductor package(60) is contacted with the contact pads(2). A multitude of conductive pin(3) is projected from an outside of the insulating plate(1). The conductive pins(3) are connected electrically with the contact pads(2). A support wall(4) of a rectangular frame shape is formed around the insulating plate(1) in order to fix and support an outer circumference of the semiconductor package(60). A receptacle(20) and an adapter(30) are used for transmitting electric signals from the universal socket(10) to a zip socket(40) of an open/short tester(50).