| 摘要 |
A system and method for packaging a semiconductor chip, the system comprising a semiconductor chip having a contact point, a top surface, and a bottom surface; a housing which encapsulates the top surface of the semiconductor chip wherein the bottom surface is unencapsulated; a pin having a top member encapsulated inside the housing and a protruding member extending outside the housing, the pin providing a conduit through which an electrical charge may travel; a bond wire electrically connected to the pin to the contact point on the semiconductor chip to provide an electrical path from the pin to the semiconductor chip; and a fixture having a matrix of cavities for receiving and supporting the protruding member of the pin during packaging. The system and method result in a packaged semiconductor device which is cost effective, results in smaller package dimensions, and reduces tooling lead-time and manufacturing costs.
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