发明名称 Method and apparatus for cleaning semiconductor wafer
摘要 To clean a semiconductor wafer without using a harmful liquid chemical solution such as piranha and organic solvent A vapor is generated by heating ultrapure water and it is blown to the surface of a semiconductor wafer at a temperature of 85° C. or higher. Even when the above-mentioned vapor is blown at a low pressure of 4.5 kg/cm2 or less, photoresist or an organic substance can be removed from the semiconductor wafer surface.
申请公布号 US2002083961(A1) 申请公布日期 2002.07.04
申请号 US20010969467 申请日期 2001.10.02
申请人 TSUGA TOSHIHITO 发明人 TSUGA TOSHIHITO
分类号 H01L21/304;B08B3/02;H01L21/00;(IPC1-7):B08B7/00 主分类号 H01L21/304
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