SELF-ALIGNED ELECTRICAL INTERCONNECT FOR TWO ASSEMBLED PERPENDICULAR SEMICONDUCTOR CHIPS

摘要

A self aligned electrical interconnect for two assembled perpendicular semiconductive chips is formed by a slot in a carrier chip having a notch wi th a metal trace. The other device chip is perpendicularly placed in the slot and has a matching metal trace. The chips are then bonded together by the traces to provide for fine perpendicular alignment of the assembled chips.