发明名称 Printed wiring board and method of manufacturing a printed wiring board
摘要 A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.
申请公布号 US2002086145(A1) 申请公布日期 2002.07.04
申请号 US20010024470 申请日期 2001.12.21
申请人 YAZAKI YOSHITARO;SHIRAISHI YOSHIHIKO;KONDO KOJI;HARADA TOSHIKAZU;YOKOCHI TOMOHIRO 发明人 YAZAKI YOSHITARO;SHIRAISHI YOSHIHIKO;KONDO KOJI;HARADA TOSHIKAZU;YOKOCHI TOMOHIRO
分类号 H05K1/09;H05K1/11;H05K3/40;H05K3/46;(IPC1-7):H05K1/03 主分类号 H05K1/09
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