发明名称 MULTILAYER BARRIER SHRINK FILMS AND PROCESS FOR THEIR MANUFACTURE
摘要 <p>Multilayer polymeric structures, particularly heat-shrinkable structures, wherein the polymers of which the layers tat are formed are chosen from the following calsses: Class A: a sealing and humidity-protection layer essentially consisting of ethylene copolymers and ethylene/alpha-olefin copolymers and blends thereof; Class B: a tie layer essentially consisting of maleic anhydride grafted polyethylenes; and, in any order; Class C: barrier layers essentially consisting of ethylene vinyl alcohol copolymers (EVOH), or EVOH containing up to 30% of a polyamide; or Class D: polyamides, such that when Class C and Class D polymers are found on adjacent layers, they cannot be the same.</p>
申请公布号 WO2002051630(A2) 申请公布日期 2002.07.04
申请号 IL2001000856 申请日期 2001.09.10
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