发明名称 METHOD OF HEAT TREATMENT OF SILICON WAFER DOPED WITH BORON
摘要 A method of subjecting a silicon wafer doped with boron to a heat treatment in an argon atmosphere, wherein said argon atmosphere is replaced by a hydrogen atmosphere or a mixed gas of an argon gas and a hydrogen gas in a proper fashion, to thereby uniformize the boron concentration in the thickness direction in the surface layer of the silicon wafer doped with boron.
申请公布号 WO02052632(A1) 申请公布日期 2002.07.04
申请号 WO2001JP11256 申请日期 2001.12.21
申请人 KOMATSU DENSHI KINZOKU KABUSHIKI KAISHA;SATO, YUJI;YOSHINO, SHIROU;FURUKAWA, HIROSHI;MATSUYAMA, HIROYUKI 发明人 SATO, YUJI;YOSHINO, SHIROU;FURUKAWA, HIROSHI;MATSUYAMA, HIROYUKI
分类号 C30B29/06;H01L21/322;H01L21/324;H01L21/336 主分类号 C30B29/06
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