发明名称 Low cost MMW transceiver packaging
摘要 A millimeter wave transceiver package is provided. Housings for electronic, RF, and support components of the transceiver with an RF transparent cover are stacked vertically in a multilayer structure. The channelized RF housing affects a reduction of 5:1 by minimizing the components placed on the housing. The design and position of the regulator/controller allows the use of surface mount parts and simplified DC and RF interfaces further contributing to design efficiency and reduced costs. Additionally, costs are reduced through the appropriate selection and application of materials. The generic housing for the millimeter wave module assembly accommodates frequencies from 20 to 40 GHz without design change, thus improving the modular character.
申请公布号 US2002086655(A1) 申请公布日期 2002.07.04
申请号 US20000749425 申请日期 2000.12.28
申请人 AMMAR DANNY F.;CLARK GAVIN JAMES;FISCHER EUGENE;HUBERT JOHN F. 发明人 AMMAR DANNY F.;CLARK GAVIN JAMES;FISCHER EUGENE;HUBERT JOHN F.
分类号 H04B1/03;(IPC1-7):H04B1/38 主分类号 H04B1/03
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