发明名称 |
Self-aligned electrical interconnect for two assembled perpendicular semiconductor chips |
摘要 |
A self-aligned electrical interconnect for two assembled perpendicular semiconductive chips is formed by a slot in a carrier chip having a notch with a metal trace. The other device chip is perpendicularly placed in the slot and has a matching metal trace. The chips are then bonded together by the traces to provide for fine perpendicular alignment of the assembled chips.
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申请公布号 |
US2002085796(A1) |
申请公布日期 |
2002.07.04 |
申请号 |
US20010754940 |
申请日期 |
2001.01.04 |
申请人 |
OPTICNET, INC. |
发明人 |
LIM MARTIN;YUN WEIJIE |
分类号 |
B81B7/00;(IPC1-7):G02B6/35 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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