| 发明名称 |
ADHESIVE, BONDING METHOD AND ASSEMBLY OF MOUNTING SUBSTRATE |
| 摘要 |
The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.
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| 申请公布号 |
US2002084019(A1) |
申请公布日期 |
2002.07.04 |
| 申请号 |
US19990438665 |
申请日期 |
1999.11.12 |
| 申请人 |
DATE HIROAKI;MOTOYAMA YUKO;TOKUHIRA HIDESHI;USUI MAKOTO;IMAIZUMI NOBUHIRO |
发明人 |
DATE HIROAKI;MOTOYAMA YUKO;TOKUHIRA HIDESHI;USUI MAKOTO;IMAIZUMI NOBUHIRO |
| 分类号 |
C09J4/06;C09J4/02;C09J5/06;C09J9/02;C09J163/00;H01L21/56;H01L21/60;H05K1/03;H05K3/30;H05K3/38;(IPC1-7):B31F1/00 |
主分类号 |
C09J4/06 |
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