Precision bonding method and apparatus

摘要

A precision clamping apparatus is described which is suitable for use with a high temperature curing process. A clamp according to the invention includes a base plate with a supporting surface for a component (which consists of two portions to be bonded together), and at least two alignment stops against which the first and second sides of the component can be pressed. A pressure plate is provided to mate with the base plate to exert uniform clamping force on the component to allow a uniform thickness of cured adhesive to form between internal surfaces of the component. The pressure plate is precisely aligned with the supporting surface in the horizontal plane by guides which allow vertical movement. The pressure plate is made self-aligning with the surface of the component by being urged toward the supporting surface by a resilient structure which is in turn held in position by attachment to the base plate. Adjustable lateral fingers are provided to urge the component against the alignment stops.