PURPOSE: A semiconductor package is provided to improve reliability of solder joint between a semiconductor package and a mother board by forming a dummy solder bar. CONSTITUTION: An insulating resin frame(41) is formed on four sides of a sealing portion and a printed circuit board. A dummy solder bar(40) is formed by projecting a solder bar(42) from a lower end of the frame(41). The frame(41) can be formed by using a conductive solder. A lower end portion of the solder bar(42) is fixed to a mother board. A semiconductor package(101) is inserted into the dummy solder bar(40). Or the dummy solder bar(40) is combined with the semiconductor package(101) by inserting adhesive into a side of the semiconductor package(101), namely outer sides of a sealing portion and a printed circuit board or an inner side of the dummy solder bar(40).
