PURPOSE: A semiconductor package is provided to maximize the number of line pattern for signal by using a heat spreader as a common ground portion. CONSTITUTION: A concave portion(3) is formed on a center portion of a heat spreader(2). A semiconductor chip(5) including a multitude of input and output pad(5a) is adhered on a bottom face of the concave portion(3). A printed circuit board(10) is formed on an outer circumference of the concave portion(3) of the heat spreader(2). A multitude of line pattern(13) including a ball land(13a) and a bond finger(13b) is formed on the printed circuit board(10). An input and output pads(5a) of the semiconductor chip(5) is connected with the bond finger(13b) of the line patterns(13) by a connection portion(6). A sealing portion(21a) is formed by the semiconductor chip(5) and the connection portion(2). A conductive ball(30) is fused on the ball land(13a). The heat spreader(2) is connected with one of the printed circuit board(10) or the input and output pads(5a) of the semiconductor chip(5) by electric connection portions(6a,6b).
