| 摘要 |
A method of press-working an inorganic substrate, which method uses a vacuum press machine having an air plunger type pressurization system and comprises bringing upper and lower heat plates which have been heated up to a predetermined temperature into contact with a combination set disposed between the upper and lower heat plates after or before the initiation of pressure reduction of a press atmosphere or under a reduced pressure and then carrying out a low pressure loading of from the initiation of pressurization to 0.05 Mpa over 10 seconds or longer and a press machine which is suitable for the above press-working method and which can set and control a low-pressure of 0.02 MPa or lower and comprises an air plunger that works as an air damper when the upper heat plate descends. The above machine and the method are a machine for press-working an inorganic substrate made of a fragile and breakable semiconductor substrate or ceramic under heat without any special skill and a press method therefor. Accordingly, bonding and holding of the semiconductor substrate to/on a holding substrate by pressurization and heating, laminate-formation of a ceramic substrate, and the like, can be carried out with a high degree of reliability.
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