High density flex interconnect for CT detectors

摘要

An enhanced photosensor module is used in a computed tomography system having a DAS system for receiving data. The module includes a substrate having a photodiode array thereon optically coupled to a scintillator array, an FET chip electrically connected to the photodetector system via a flex connector and mounted on the substrate. The module also includes a flex circuit connected to the FET chip and the DAS system. The flex circuit is mounted on the substrate and positioned 90 degrees to the substrate.